Tindall, Craig
Normalized to: Tindall, C.
1 article(s) in total. 13 co-authors. Median position in authors list is 14,0.
[1]
oai:arXiv.org:1604.00170 [pdf] - 1384228
X-ray Performance of Back-Side Illuminated Type of Kyoto's X-ray
Astronomical SOI Pixel Sensor, XRPIX
Itou, Makoto;
Tsuru, Takeshi Go;
Tanaka, Takaaki;
Takeda, Ayaki;
Matsumura, Hideaki;
Ohmura, Shunichi;
Nakashima, Shinya;
Arai, Yasuo;
Mori, Koji;
Takenaka, Ryota;
Nishioka, Yusuke;
Kohmura, Takayoshi;
Tamasawa, Koki;
Tindall, Craig
Submitted: 2016-04-01
We have been developing X-ray SOI pixel Sensors, called "XRPIX", for future
X-ray astronomy satellites that enable us to observe in the wide energy band of
0.5-40 keV. Since XRPIXs have the circuitry layer with a thickness of about 8
{\mu}m in the front side of the sensor, it is impossible to detect low energy
X-rays with a front-illuminated type. So, we have been developing
back-illuminated type of XRPIX with a less 1 {\mu}m dead layer in the
back-side, which enables the sensitivity to reach 0.5 keV. We produced two
types of back-side illuminated (BI) XRPIXs, one of which is produced in "Pizza
process" which LBNL developed and the other is processed in the ion
implantation and laser annealing. We irradiated both of the BI-XRPIXs with soft
X-ray and investigate soft X-ray performance of them. We report results from
soft X-ray evaluation test of the device.