Normalized to: Dickie, M.
[1]
oai:arXiv.org:1102.2241 [pdf] - 1052037
UV anti-reflection coatings for use in silicon detector design
Submitted: 2011-02-10
We report on the development of coatings for a CCD detector optimized for use
in a fixed dispersion UV spectrograph. Due to the rapidly changing index of
refraction of Si, single layer broadband anti-reflection coatings are not
suitable to increase quantum efficiency at all wavelengths of interest.
Instead, we describe a creative solution that provides excellent performance
over UV wavelengths. We describe progress in the development of a CCD detector
with theoretical quantum efficiencies (QE) of greater than 60% at wavelengths
from 120 to 300nm. This high efficiency may be reached by coating a backside
illuminated, thinned, delta-doped CCD with a series of thin film
anti-reflection coatings. The materials tested include MgF2 (optimized for
highest performance from 120-150nm), SiO2 (150-180nm), Al2O3(180-240nm), MgO
(200-250nm), and HfO2 (240-300nm). A variety of deposition techniques were
tested and a selection of coatings which minimized reflectance on a Si test
wafer were applied to live devices. We also discuss future uses and
improvements, including graded and multi-layer coatings.
[2]
oai:arXiv.org:0904.1991 [pdf] - 23297
Large Focal Plane Arrays for Future Missions
Scowen, Paul A.;
Nikzad, Shouleh;
Hoenk, Michael;
Gontijo, Ivair;
Shapiro, Andrew;
Greer, Frank;
Jones, Todd;
Seshadri, Suresh;
Jacquot, Blake;
Monacos, Steve;
Lisman, Doug;
Dickie, Matthew;
Blacksberg, Jordana
Submitted: 2009-04-13
We outline the challenges associated with the development and construction of
large focal plane arrays for use both on the ground and in space. Using lessons
learned from existing JPL-led and ASU/JPL partnership efforts to develop
technology for, and design such arrays and imagers for large focal planes, we
enumerate here the remaining problems that need to be solved to make such a
venture viable. Technologies we consider vital for further development include:
(1) architectures, processes, circuits, and readout solutions for production
and integration of four-side buttable, low-cost, high-fidelity,
high-performance, and high-reliability CCD and CMOS imagers; (2) modular,
four-side buttable packaging of CCD/CMOS imagers; (3) techniques and hardware
to test and characterize the large number of chips required to produce the
hundreds of flight-grade detectors needed for large focal-plane missions being
conceived at this time; (4) ground based testbed needs, such as a large format
camera mounted on a ground-based telescope, to field test the detectors and the
focal plane technology solutions; and (5) validation of critical sub-components
of the design on a balloon mission to ensure their flight-readiness. This paper
outlines the steps required to provide a mature solution to the astronomical
community with a minimal investment, building on years of planning and
investments already completed at JPL.